An interconnection system for coupling electrical and air pressurized conductors carried by an aircraft wing and a missile pylon mounted on the wing. The interconnection system provides a rapidly releasable positive lock between the pylon and the wing.

Spring 52 mounts on cold plate 12 to urge thermal conductive layers 82 against flange 20 on cold plate 12. Spring has a plurality of pressure flanges, one corresponding to each cold plate flange so that a unitary spring structure can be quickly assembled on the cold plate. Thermal interconnection is expected to be used on all standard and improved standard electronic modules. It is being designed into ANSQS-53.

A demountable interconnection for use with material handling and excavating equipment includes a dual hook carriage which may be semi-permanently attached to the boom or dipperstick of a material handler and suitable structures such as parallel beams disposed in the material handling attachment which may be selectively engaged by the dual hook carriage. A locking clevis is movable between a first position and a second position to lock or release the carriage from the attachment.

A serial switched interconnection network comprises several stages of switching units each having a plurality of source ports and destination ports interconnected so that any source port of the first stage can be connected to any destination port of the final stage by operation of switching units in successive stages. Connections are by shared data and control paths each of which paths may comprise a single line or multiple lines and each switching unit when switched to along a path sends a requ...

Proposed is an interconnection medium which is tolerant of faults in at least one of the conductors. Redundancy is established to components connected to the medium by providing additional conductors and steering the signals between components to appropriate conductors in the event of a fault. Preferably, the conductors are arranged in a way which balances the amount of additional wiring and the amount of added parasitic loading.

An aluminum interconnection of the invention contains scandium as an impurity, so that the hardness of the interconnection is improved. Moreover, after a thin Al--Sc alloy film is formed, an annealing is performed so as to make the crystal grain larger than the width of the interconnection. The resulting Al interconnection has a high resistance against a stressmigration or electromigration, when a current stress is applied at a practical temperature in an LSI. This greatly contributes to the fab...

The invention relates to an electrical connector that can be used to electrically connect a daughtercard to a backplane.

An interconnection device includes a carrier housing formed of non-conductive material and has at least one cavity extending through the housing. Within the cavity is disposed a non-formed compression contact that has a cantilevered beam portion that is tapered along its length. The may be tapered such that that deflection of the beam occurs across substantially the entire length of the beam when a compression force is applied to the contact. The contact may be installed in the housing such that...

A method of forming bumped substrates with protuberances for inverted or flip-connection bonding of electronic devices including semiconductor devices, integrated circuits, and/or application specific integrated circuits and electromechanical devices. The substrates are high temperature insulating materials provided with a conductive pattern. The conductive pattern has contact areas corresponding to the input/output (I/O) pads of the electronic device. A metal is applied over the contact areas, ...

The present invention relates to a copper interconnection comprising a copper or copper alloy layer, wherein at least 50% of crystal grains of copper or a copper alloy form twins. A copper interconnection of the present invention is, therefore, highly reliable, and, a production cost thereof is low.