A substrate for electronic components has a layer of material covering at least a portion of the substrate. Recesses are formed in a layer of material and located in a pattern relative to each other to form a predetermined temperature distribution across the layer of material. The layer of material can be formed as a resistive film for a heating resistor element. The shape, size and pattern of the recesses are selected to balance the thermal stress across the surface of the layer of material.

A substrate for electronic components has a layer of material covering at least a portion of the substrate. Recesses are formed in a layer of material and located in a pattern relative to each other to form a predetermined temperature distribution across the layer of material. The layer of material can be formed as a resistive film for a heating resistor element. The shape, size and pattern of the recesses are selected to balance the thermal stress across the surface of the layer of material.

An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the gro...

A substrate has a base, an intermediate layer, a conductive layer, and conductive films. The base is a ceramic insulator. The intermediate layer is on a main surface of the base. The conductive layer is on the intermediate layer. The conductive films are on the conductive layer, covering an exposed portion of the conductive layer.

The present invention relates to a membrane electrode assembly wherein each gas diffusion substrate comprises a porous electrically conductive gasket member is located on the first and second planar faces of a peripheral portion of the sheet material. The electrocatalyst layers are not present adjacent to the gasket members and the edge of the membrane is sandwiched between the gasket members. The invention further relates to integrated cell assemblies and fuel cell stacks comprising membrane el...

A substrate comprises a porous polymeric material having a porosity of at least 75% and comprising pores having a diameter within the range 1 to 100 .mu.m and being interconnected by a plurality of holes, and a gel or material adapted in use to form a gel which gel or pre-gel materials is contained and retained within the pores of the polymeric material and is adapted in use to interact with a reactive species and can be made by depositing and retaining the gel or a material adapted in use to fo...

A substrate having two parallel planar faces and an edge with a groove is simultaneously coated on both sides in a vacuum chamber. The substrate is raised, lowered and held on edge while the parallel faces are vertically disposed by a blade inserted into the groove so that while the substrate is coated an unobstructed path exists for the coating material to the faces.

Apparatus for automatically loading ceramic substrates of the type carrying integrated electronic circuits on clip-type terminals. Terminal strip feed means indexes a number of clip-type terminals to a loading zone and ceramic substrate feed means positions a ceramic substrate adjacent the terminals. A pusher moves the substrate laterally to engage one edge of the substrate with the clip-type terminals so that each terminal is in physical contact with a metallic contact pad on the edge of the su...

The invention concerns connectors having an elongate spring body of elastomer or formed as a tubular spring about which a single layer wire coil is wound. The coil turns are separated by cutting the coil longitudinally of the body to define discrete conductive paths of C-shape extending round part of the circumferential profile of the body. Exposed surface portions of the wires present contact points in a row along the body. Each C-shaped turn may present a pair of diametrically opposite contact...

Apparatus for providing electrical circuit components with terminal pins firmly secured to the component substrate. Both method and apparatus are provided serving to automatically position a terminal pin with respect to the substrate, and to form a head on the pin on one surface of the substrate, and a bulge on the pin adjacent the opposite surface of the substrate from the head to secure the pin with respect to the substrate without damaging the substrate.