A method of forming a transistor includes the steps of forming a gate structure (56) overlying a gate oxide layer (54), wherein the gate structure (56) and gate oxide layer (54) overlie a substrate (50), thereby separating the substrate (50) into a first region (90) and a second region (92) with a channel region therebetween. The method also includes doping the gate structure (56), the first region (90) and the second region (92) and annealing the doped gate structure (56) with a laser anneal, t…

The present invention relates to a system and methodology facilitating remote namespace management in an industrial control environment. An industrial control system is provided that includes an industrial controller to communicate with a network such as the Internet. Namespace information relating to network locations of associated control devices are accumulated by the control system and/or a server interacting with the control system. The accumulated namespace data can then be employed to man…

A system and method is provided for adjusting transmission power of different portions of a data packet. The system and method is especially useful when utilizing the IEEE 802.11 standard protocol due to the varying transmission data rates of a packet. A IEEE 802.11 packet includes a preamble portion, a header portion and a data portion. The preamble portion has a data rate of 1 Mbps, the header has a data rate of 1 or 2 Mbps and the data portion has a data rate of 1, 2, 5.5 or 11 Mbps. At a giv…

The subject invention relates to a Universal Graphics Adapter (UGA) that is a hardware-independent design that encapsulates and abstracts low-level graphics hardware in a standard manner through firmware. UGA is a firmware standard, intended to wrap existing or planned hardware, including VGA. UGA does not require the use of real-mode assembly language, direct hardware register, or frame buffer access to program, thus providing advantages over conventional systems. UGA supports basic drawing ope…

A semiconductor device which includes a substrate and a conductive pattern formed on the substrate. The conductive pattern includes at least two conductive lines adjacent one another. A low dielectric constant (LDC) material is dispersed between the at least two conductive lines. The LDC material includes a polymeric material including a polymer having a first and second end. The first end includes a functional group adapted to substantially bond to an insulating layer covering at least a portio…

The present invention relates to network communication systems for managing client/server connections in a wireless environment. In accordance with the invention, a mobile communication unit (ie., client), deploys keep alive packets at selected times in order to reset a keep idle timer of a server (e.g., host computer). By periodically resetting the keep idle timer a current connection between the mobile communication unit and server can be maintained as long as desired even when the mobile comm…

The present invention relates to a method for fabricating interconnecting lines and vias in a layer of insulating material. A via is formed in the layer of insulating material. A protective material is formed so as to be conformal to at least edges and sidewalls of the via, the protective material facilitating shielding of at least the edges and sidewalls of the via from a trench etch step. The trench etch step is performed to form a trench opening in the insulating material. The via and trench …

A method (100) and a system (150) for detecting defects in a dielectric material (112) includes the steps of moving carriers (102) in the dielectric material (112), wherein the number of carriers is a function of whether defects exist in the dielectric material (112). The carriers are then deflected (130) toward a surface (116) of the dielectric material (112) using, for example, a magnetic field (132), and form an accumulated charge profile on the surface (116) of the dielectric material (112)….

In one embodiment, the present invention relates to a method of cleaning a low pressure chemical vapor deposition apparatus having TEOS material build-up therein involving contacting the low pressure chemical vapor deposition apparatus with a composition containing at least one lower alcohol. In another embodiment, the present invention relates to a system for cleaning a low pressure chemical vapor deposition apparatus having TEOS material build-up therein, containing a supply of a composition c…

A method of forming a via structure is provided. In the method, a dielectric layer is formed on an anti-reflective coating (ARC) layer covering a first metal layer; and a nitride layer is formed on the dielectric layer. An ultra-thin photoresist layer is formed on the nitride layer, and the ultra-thin photoresist layer is patterned with short wavelength radiation to define a pattern for a via. The patterned ultra-thin photoresist layer is used as a mask during a first etch step to transfer the v…